《Journal of Electronics Cooling and Thermal Control》

作品数：86被引量：37H指数：3
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《Journal of Electronics Cooling and Thermal Control》
主办单位：美国科研出版社
最新期次：2024年4期更多>>
发文主题：COOLINGHEATTHERMALCONVECTIONFORCED更多>>
发文领域：医药卫生理学动力工程及工程热物理金属学及工艺更多>>
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Image Processing Based Colony Identification Research
《Journal of Electronics Cooling and Thermal Control》2024年第4期61-73,共13页Biao Huang Shiping Zou 
Aiming at the shortcomings of the existing automatic colony counter, a set of algorithms based on the principle of image chromatic aberration to achieve colony identification is proposed, and a colony identification d...
关键词：Colony Identification Colony Counting Image Recognition Colony Identification 
Tea Image Recognition and Research on Structure of Tea Picking End-Effector
《Journal of Electronics Cooling and Thermal Control》2024年第3期51-60,共10页Biao Huang Shiping Zou 
The automated picking technology of tea is an important part of the development of smart agriculture, which affects the development of the tea industry to a certain extent. Tea leaf recognition and robotic tea picking...
关键词：Image Recognition of Tea Leaves Tea Picking End-Effector Tea PickingStructure Design 
Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant
《Journal of Electronics Cooling and Thermal Control》2024年第2期35-49,共15页Waheeb Mukatash Hussameddine Kabbani Jochem Marc Massalt Matthew Moscoso Merari Mejia Robles Tyler Yang Charlie Nino 
High power dissipating artificial intelligence (AI) chips require significant cooling to operate at maximum performance. Current trends regarding the integration of AI, as well as the power/cooling demands of high-per...
关键词：Artificial Intelligence Thermal Control Server Systems Vapor Compression Refrigeration Cycle Server Cooling 
Investigation of Liquid Cooling Plate for Server CPUs Based on Topology Optimization
《Journal of Electronics Cooling and Thermal Control》2024年第1期1-34,共34页Guijun Ai Yingying Luo Wei Su 
In this study, a microchannel liquid cooling plate (LCP) is proposed for Intel Xeon 52.5 mm * 45 mm packaged architecture processors based on topology optimization (TO). Firstly, a mathematical model for topology opti...
关键词：CPU SEVER Data Center Topology Optimization Liquid Cooling Plate 
A Theoretical Study on Energy of a Gaseous System Vis-a-Vis Mass and Temperature
《Journal of Electronics Cooling and Thermal Control》2023年第1期1-8,共8页Santosh K. Karn Necati Demiroglu 
To study various properties of a gas has been a subject of rational curiosity in pneumatic sciences. A gaseous system, in general, is studied by using four measurable parameters namely, the pressure, volume, number of...
关键词：HYDRODYNAMICS Low Temperature Fluid Flow Ideal Gas Equation of State ENERGY MASS Temperature and Their Relation 
Numerical Study of Thin Film Condensation in Forced Convection of Saturated Vapor on a Vertical Wall Covered with a Porous Material
《Journal of Electronics Cooling and Thermal Control》2022年第1期1-12,共12页Momath Ndiaye Goumbo Ndiaye Madialène Sene 
The study of forced convection in a porous medium has aroused and still arouses today the interest of many scientists and industrialists. A considerable amount of work has been undertaken following the discovery of th...
关键词：CONDENSATION Implicit Finite Differences Thin Film Porous Material Darcy-Brinkman Model Vertical Wall 
Techno-Economic and Sustainability Analysis of Potential Cooling Methods in Irish Data Centres
《Journal of Electronics Cooling and Thermal Control》2021年第3期35-54,共20页Lee Gibbons Tim Persoons Sajad Alimohammadi 
11% of Irish electricity was consumed by data centres in 2020. The Irish data centre industry and the cooling methods utilised require reformative actions in the coming years to meet EU Energy policies. The resell of ...
关键词：IRELAND Data Centres TECHNO-ECONOMIC Novel Cooling Methods Heat Resell SUSTAINABILITY Energy Demand 
Best Practices for Thermal Modeling in Microelectronics with Natural Convection Cooling: Sensitivity Analysis
《Journal of Electronics Cooling and Thermal Control》2021年第2期15-33,共19页Mamadou Kabirou Touré Papa Momar Souaré Julien Sylvestre 
A detailed sensitivity study was carried out on various key parameters from a high precision numerical model of a microelectronic package cooled by natural convection, to provide rules for the thermal modeling of micr...
关键词：Computational Fluid Dynamics Computational Heat Transfer Microelectronic Packaging Natural Convection RADIATION Thermal Analysis Thermal Management 
New Measurement Method for Direct Cooled Power Electronic with Transmission Fluids
《Journal of Electronics Cooling and Thermal Control》2021年第1期1-13,共13页Andreas Griesinger Christian Windel Yungwan Kwak Arthur Petuchow 
Power Electronic (PE) will play an essential role in future drive concepts. Nowadays, mainly water/glycol-based cooling media are used to cool PE. Due to their high electrical conductivity (EC), water/glycol-based coo...
关键词：Thermal Transient Method Heat Transfer Coefficient Direct Cooling Trans-mission Fluids 
Optimal Thermal Insulation Thickness in Isolated Air-Conditioned Buildings and Economic Analysis
《Journal of Electronics Cooling and Thermal Control》2020年第2期23-45,共23页Mousa M. Mohamed 
The removal building heat load and electrical power consumption by air conditioning system are proportional to the outside conditions and solar radiation intensity. Building construction materials has substantial effe...
关键词：Building Heat Load Cooling Load Temperature Difference Energy Saving Power Consumption Annual Cooling Degree-Day Optimal Thermal Insulation Thickness Payback Period 
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