SOLDERING

作品数：51被引量：68H指数：5
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相关领域：金属学及工艺一般工业技术更多>>
相关作者：傅玉灿丁文锋杨长勇付建峰徐九华更多>>
相关机构：金蝶软件(中国)有限公司南京航空航天大学国电南瑞科技股份有限公司哈尔滨工业大学更多>>
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相关基金：国家自然科学基金国家重点基础研究发展计划中国博士后科学基金国家教育部博士点基金更多>>
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Microstructure and properties of AgCu/2 wt%Ag-added Sn-Pb solder/CuBe joints fabricated by vapor phase soldering
《Rare Metals》2022年第6期1983-1988,共6页Wei Liu Rong An Ying Ding Chun-Qing Wang Yan-Hong Tian Kun Shen 
financially supported by the National Natural Science Foundation of China (No.51375003)
The purpose of this paper is to investigate the effect of 2 wt%Ag addition in Sn-Pb eutectic solder on microstructure and mechanical properties of AgCu/solder/CuBe joint fabricated by vapor phase soldering.63Sn37Pb an...
关键词：Microstructure Mechanical property 62Sn36Pb2Ag solder Ag Sn Vapor phase soldering 
Soldering of Zr-based bulk metallic glass and copper by Au-12Ge eutectic alloy被引量：2
《Rare Metals》2019年第1期52-58,共7页Jun Wang Jing Cui Hong-Chao Kou Heng Guan Jin-Shan Li 
financially supported by the Natural Science Basic Research Plan in Shaanxi Province of China (No. 2014JM6234);the Specialized Research Fund for Doctoral Program of Higher Education (No. 20136102120007);the Program of Introducing Talents of Discipline to Universities (No. B08040)
Zr-based bulk metallic glass and copper with different surface roughness were soldered using low temperature eutectic Au-12 Ge(wt%) solder on a thermomechanical simulator. The cross-sectional microstructures of the br...
关键词：BULK METALLIC glass SOLDERING Au-Ge EUTECTIC alloy Interface 
Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
《Rare Metals》2009年第6期656-660,共5页CHEN Wenxue XUE Songbai WANG Hui WANG Jianxin HAN Zongjie 
supported by the Jiangsu Six-kind Skilled Personnel Project,China (No.06-E-020)
The eutectic Sn-9Zn alloy was doped with Ag （0 wt.%-1 wt.%） to form Sn-9Zn-xAg lead-free solder alloys. The effect of the addition of Ag on the microstructure and solderability of this alloy was investigated and int...
关键词：soldering materials lead-free solder WETTABILITY intermetallic compounds 
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