DIMPLE

作品数：38被引量：77H指数：5
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相关领域：一般工业技术金属学及工艺更多>>
相关作者：徐巍肖林孙巧艳孙军尹雁飞更多>>
相关机构：西安交通大学西北有色金属研究院武汉理工大学珠海方正科技多层电路板有限公司富山分公司更多>>
相关期刊：《Communications in Theoretical Physics》《Frontiers in Heat and Mass Transfer》《Journal of Thermal Science》《Chinese Physics B》更多>>
相关基金：国家自然科学基金国家重点基础研究发展计划高等学校学科创新引智计划国家教育部博士点基金更多>>
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Numerical Investigation of Flow and Heat Transfer in Vane Impingement/Effusion Cooling with Various Rib/Dimple Structure被引量：1
《Journal of Thermal Science》2023年第4期1357-1377,共21页WANG Mingrui ZHU Huiren LIU Cunliang WANG Rui WU Zhuang YAO Chunyi 
This study is financially supported by the National Science and Technology Major Project(2017-III-0003-0027).
By investigating heat transfer and flow structures of dimples,orthogonal ribs,and V-shaped ribs in the impingement/effusion cooling,the article is dedicated to selecting a best-performing internal cooling structure fo...
关键词：conjugate heat transfer impingement cooling DIMPLE V-shape rib discharge coefficient 
Optimization of Dimples in Microchannel Heat Sink with Impinging Jets-Part B： the Influences of Dimple Height and Arrangement被引量：4
《Journal of Thermal Science》2018年第4期321-330,共10页MING Tingzhen CAI Cunjin YANG Wei SHEN Wenqing FENG Wei ZHOU Nan 
financially supported by the National Natural Science Foundation of China(Grant No.51778511);the Hubei Provincial Natural Science Foundation of China(Grant No.2018CFA029);the Key Project of ESI Discipline Development of Wuhan University of Technology(WUT Grant No.2017001)
The combination of a microchannel heat sink with impinging jets and dimples(MHSIJD) can effectively improve the flow and heat transfer performance on the cooling surface of electronic devices with very high heat fluxe...
关键词：microchannel with impinging jets and dimples impinging jet dimple heat transfer enhancement thermal resistance 
Optimization of Dimples in Microchannel Heat Sink with Impinging Jets Part A： Mathematical Model and the Influence of Dimple Radius被引量：7
《Journal of Thermal Science》2018年第3期195-202,共8页MING Tingzhen CAI Cunjin YANG Wei SHEN Wenqing GAN Ting 
financially supported by the National Natural Science Foundation of China(Grant No.51778511);the Hubei Provincial Natural Science Foundation of China(Grant No.2018CFA029);the Key Project of ESI Discipline Development of Wuhan University of Technology(WUT Grant No.2017001)
With increasing heat fluxes caused by electronic components, dimples have attracted wide attention by researchers and have been applied to microchannel heat sink in modem advanced cooling technologies. In this work, t...
关键词：Microchannel with Impinging Jet DIMPLE Heat Transfer Enhancement Thermal Resistance Numerical Simulation 
A Review of Heat Transfer Enhancement through Flow Disruption in a Microchannel被引量：7
《Journal of Thermal Science》2015年第3期203-214,共12页Anupam Dewan Pankaj Srivastava 
In this paper a comprehensive review of heat transfer enhancement through microchannels has been presented. Over the past few years due to multifunetion, shrinking package size and high power dissipation, the heat flu...
关键词：MICROCHANNEL heat transfer enhancement boundary-layer pressure drop dimple surface cavitiesand ribs 
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