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作品数:192被引量:232H指数:8
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相关作者:陈彬王传兵田晖更多>>
相关机构:北京大学中国科学技术大学湘潭大学中国科学院国家天文台更多>>
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GHz bursts in MHz burst(BiBurst) enabling high-speed femtosecond laser ablation of silicon due to prevention of air ionization被引量:2
《International Journal of Extreme Manufacturing》2023年第2期208-214,共7页Kotaro Obata Francesc Caballero-Lucas Shota Kawabata Godai Miyaji Koji Sugioka 
supported by MEXT Quantum Leap Flagship Program (MEXT Q-LEAP) Grant Number JPMXS0118067246。
For the practical use of femtosecond laser ablation, inputs of higher laser intensity are preferred to attain high-throughput material removal. However, the use of higher laser intensities for increasing ablation rate...
关键词:BiBurst mode GHz burst laser ablation SILICON air ionization 
High efficiency GHz laser processing with long bursts
《International Journal of Extreme Manufacturing》2023年第1期202-210,共9页Eric Audouard Eric Mottay 
Bursts of GHz repetition rate pulses involve more ablation mechanisms than single femtosecond pulses.Efficient ablation by GHz laser pulses is a multi-step process,consisting of a first thermal incubation phase,follow...
关键词:femtosecond laser temporal pulses shaping GHz bursts femtosecond processing 
Enhanced ablation efficiency for silicon by femtosecond laser microprocessing with GHz bursts in MHz bursts(BiBurst)被引量:3
《International Journal of Extreme Manufacturing》2022年第1期75-83,共9页Francesc Caballero-Lucas Kotaro Obata Koji Sugioka 
partially supported by MEXT Quantum Leap Flagship Program(MEXT Q-LEAP)Grant Number JPMXS0118067246。
Ultrashort laser pulses confine material processing to the laser-irradiated area by suppressing heat diffusion,resulting in precise ablation in diverse materials.However,challenges occur when high speed material remov...
关键词:BiBurst mode GHz burst laser ablation surface microfabrication 
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