高频多层刚挠结合板制作技术  

High-frequency multilayer R-FPCB production technology

作　　者：江赵哲 张国兴 Jiang Zhaozhe;Zhang Guoxing

机构地区：[1]湖南维胜科技有限公司,湖南长沙410100 [2]湖南维胜科技电路板有限公司,湖南长沙410100

出　　处：《印制电路信息》2024年第S02期133-139,共7页Printed Circuit Information

摘　　要：随着科技进步,电子产品不断更新迭代,对于信号的传输效率和稳定性提出了更高要求,促使印制电路板朝着高频高速方向发展。刚挠结合板作为印制电路板重要的一种产品类型,兼具了硬板的稳定性和挠板的灵活性,其市场需求逐年上升。本文基于一款高频十层刚挠结合板,分享其材料测试、压合、钻孔、等离子处理等关键工艺技术,为高频多层刚挠结合板的加工提供参考。With the advancement of science and technology,electronic products are constantly updated,and higher requirements for signal transmission efficiency and stability have been put forward,prompting the development of printed circuit boards in the direction of high-frequency and high-speed.As an important product type of printed circuit boards,R-FPCB have the stability of rigid boards and the flexibility of flex boards,and their market demand is increasing year by year.Based on a high-frequency ten-layer R-FPCB,this paper shares the key technologies of material testing,lamination,drilling,plasma,etc.,to provide reference for the processing of high-frequency multilayer R-FPCB.

关 键 词：高频材料 多层板 刚挠结合板 工艺流程 

分 类 号：TN41[电子电信—微电子学与固体电子学]