用于下一代信号和通流能力提升的微槽孔加工研究  

Research on micro Slot machining for improving next generation signal and flow capacity

作　　者：曹磊磊 雷川 孙军 杨剑 徐竟成 何为 陈苑明 Cao Leilei;Lei Chuan;Sun Jun;Yang Jian;Xu Jingcheng;He Wei;Chen Yuanming

机构地区：[1]重庆方正高密电子有限公司,重庆沙坪坝401332 [2]电子科技大学材料与能源学院,四川成都610054

出　　处：《印制电路信息》2023年第S02期336-349,共14页Printed Circuit Information

摘　　要：随着科学技术的发展,PCB板设计向着小型化及高密度的方向发展,在PCB板上往往会使用较多的大功耗器件。然而由于空间限制,大功耗器件无法有效的自然散热,而引起诸多可靠性问题。相应的,PCB中也需要形成低电压大电流的电路,以使电路的载流可以满足电路板所需要的最大电流量,保证电路运行的不稳定。为了兼顾电路的载流能力和电子产品的小型化,可以减小过孔的尺寸,以降低电路板的面积,并保证电路的载流能力。然而,过孔的尺寸越小,相对应的通孔的制作和电镀难度越大,过孔越不易制作,且过孔的寄生电容和寄生电感均会影响电路板的性能。根据行业的发展方向,以及系统级芯片和现场可编程逻辑门阵列(FPGA)型技术的发展路线,就会试图在印制电路板通孔上加大垂直通流,以确保大功率信号传输。这种发展方向有利于将其推向高性能发展的前沿。紧随其后,垂直通流的增加,势必会产生散热问题,于是便有了通过开设微槽孔提升通流能力和散热能力。With the development of science and technology,PCB board design is moving towards miniaturization and high density,and more high-power devices are often used on PCB boards.However,due to space limitations,highpower devices cannot effectively dissipate heat naturally,resulting in many reliability issues.Correspondingly,a low voltage and high current circuit needs to be formed in the PCB to ensure that the current carrying capacity of the circuit can meet the maximum current required by the circuit board and ensure the unstable operation of the circuit.In order to balance the current carrying capacity of the circuit and the miniaturization of electronic products,the size of the via can be reduced to reduce the area of the circuit board and ensure the current carrying capacity of the circuit.However,the smaller the size of the vias,the greater the difficulty in making and electroplating the corresponding vias.The vias are less easy to make,and the parasitic capacitance and inductance of the vias can affect the performance of the circuit board.According to the development direction of the industry and the development route of system level chip and Field-programmable gate array(FPGA)technology,we will try to increase the vertical through flow on the PCB through hole to ensure high power signal transmission.This development direction is conducive to pushing it to the forefront of high-performance development.Following closely,the increase in vertical flow will inevitably lead to heat dissipation problems,so there is a need to improve flow and heat dissipation capacity by opening micro slots.

关 键 词：微槽孔 通流 载流能力 电源平面 寄生电容 寄生电感 孔金属化 

分 类 号：TN41[电子电信—微电子学与固体电子学]