CPU界面传热过程热接触模型研究  

Research on the heat Contact Model of Interfacial Heat Transfer Process between CPU and Radiator

作　　者：陈进[1] 傅建玲[1] 刘骁[1] 李宝华[1] 王伯营[1] 王惠龄[2] 

机构地区：[1]武汉理工大学自动化学院 [2]华中科技大学制冷与低温工程研究所

出　　处：《微计算机信息》2008年第10期239-240,共2页Control & Automation

基　　金：教育部博士基金课题(20040487039);武汉理工大学博士科研经费(471-38300851)

摘　　要：该文设计了CPU与散热器之间界面传热实验装置,研究散热器承受不同压力条件下的界面传热规律,建立了CPU界面传热的热接触模型。研究结果表明该模型误差小于5%;随着接触压力和界面温度的提高,接触界面热阻随着减小;接触压力越高,界面热阻随温度变化越慢。It is designed that an experiment device was used to testing boundary thermal resistance between CPU and radiator in this paper. Investigation has been made for the law of boundary heat transfer process in different pressure, temperature and building the heat contact model. The results were shown that error of the model is less than 5%, the thermal boundary resistance between CPU and radiator was reduced with the increase of interface pressure and the interface temperature. However, the change of boundary r...

关 键 词：CPU 界面热阻 热接触模型 

分 类 号：TP332[自动化与计算机技术—计算机系统结构]