系统微集成技术的发展  

Development of system microintegation Technology

作　　者：路荣先[1] 

机构地区：[1]中物院电子工程研究所,四川绵阳621900

出　　处：《探测与控制学报》2000年第3期3-7,共5页Journal of Detection & Control

摘　　要：介绍了 2 0世纪 90年代以来出现的几种微型封装技术。某些封装工艺对现代微小型电子系统诸如一次性使用的电子部件、引信系统等起着重要的作用。新的封装技术为从事现代引信系统开发的工程技术人员 。This paper presents all kinds of microsystem packaging technology which have appeared since the nineties of the 20th century. Some of them play an important role in modorn microelectronic systems such as once used electronic assemblies, fuze systems and so on. The new packaging technology provides a new concept to realize miniaturization and to improve reliability for the technicians who are engaged in the development of modern fuze systems.

关 键 词：硅晶片 微集成 多芯片模块 机械电子学 微机电系统 表面粘贴技术 

分 类 号：TN[电子电信] 304.1+2