BGA封装互连焊点温度及电流密度分布的模拟与验证  

Simulation and Verification of Temperature and Current Density Distribution of BGA Package

作　　者：薛明阳[1] 卫国强[1] 黄延禄[1] 姚健[1] 

机构地区：[1]华南理工大学机械与汽车工程学院

出　　处：《航空制造技术》2011年第17期75-77,93,共4页Aeronautical Manufacturing Technology

摘　　要：芯片互连焊点承受的电流密度越来越大,给电子产品的服役可靠性带来了新的挑战。本文利用有限元软件对BGA封装互连焊点内温度及电流密度分布进行了模拟分析,结果表明:互连焊点的芯片端和基板端存在很大的温度差,在本模拟条件下,最大温度梯度可达到5.38×103K/cm;在焊点的电流入口∕出口处存在电流拥挤,其电流密度比平均电流密度大2-3个数量级。并和实际测量的焊点温度进行了比较,模拟分析与实际器件温度测量结果吻合较好。The current density in the interconnecting solder joint is increased significantly,which brings new challenges to the reliability of electronic products.Finite element software is used to simulate the distribution of temperature and current density in BGA package solder joints,the numerical simulation results show that there is a great temperature difference between chip side and substrate side of solder joints,the maximum temperature gradient reaches 5.38×103K/cm,the current crowding exists at the entrance/exit of current in solder joints,the current density is 2-3 orders of magnitude higher than the average one.Meanwhile,the results of simulation are also compared with the well-designed experiment,which are in good agreement with the actual experimental ones.

关 键 词：BGA 数值模拟 温度梯度 电流密度 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]