大尺寸硅片智能化CMP监控系统研究  

Study on intelligent CMP monitoring system of large-size silicon wafer

作　　者：郭晓光[1] 张小冀[1] 郭东明[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116021

出　　处：《金刚石与磨料磨具工程》2012年第5期42-45,51,共5页Diamond & Abrasives Engineering

基　　金：中央高校基本科研业务费专项资金资助(DUT11SX05)

摘　　要：将智能控制的设计思想和各工艺参数对化学机械抛光(CMP)的影响机理相结合,开发了智能化CMP监控系统,该系统具有学习、推理和记忆的功能,适用于多种CMP设备。系统得出的工艺参数可以直接控制CMP抛光机的各控制单元,并且与以往的凭借经验的加工方式相比,系统操作界面友好,输入简单,易于操作。通过对硅片CMP过程进行全面地智能监控,可实现硅片智能化批量生产,并且在保证硅片加工质量的前提下,可以大幅提高生产效率。The design ideas of intelligent control and the influencing mechanism of the process parameters on chemical mechanical polishing(CMP) are combined to develop the intelligent CMP monitoring system,which has the function of learning,inference and memory.The system can be used in many kinds of CMP facilities,the process parameter from the system can be used to control each unit of the CMP facility.Compared with the conventional way of processing by virtue of experience,the system has friendly operator interface and is easy to operate.The volume production of silicon wafers can be achieved by the total intelligent monitoring of CMP.The efficiency of production can be improved highly and the quality can be ensured.

关 键 词：智能监控 硅片 化学机械抛光(CMP) 生产效率 

分 类 号：TP277[自动化与计算机技术—检测技术与自动化装置] TG175[自动化与计算机技术—控制科学与工程]