基于Pro/Mechanica的IPM散热分析及优化  

Analysis and Optimization of IPM Thermolysis Based on Pro/Mechanica

作　　者：甘屹[1] 王兆凯[1] 孙福佳[1] 何燕[2] 

机构地区：[1]上海理工大学机械工程学院,上海200093 [2]上海师范大学天华学院,上海201815

出　　处：《功能材料与器件学报》2013年第1期15-19,共5页Journal of Functional Materials and Devices

摘　　要：建立了三菱IPM的简化热模型,利用有限元分析方法,运用Pro/Mechanica为对其工作温度场进行了分析。针对芯片自身结温超过芯片的最大可承受温度的情况,对IPM的散热性能提出了优化方案,采用针形散热器以实现其外表热量的快速散发。并提出一种新型的封装形式,即用塑封树脂和铝合金进行混合封装。通过热分析表明,该封装对于IPM芯片散热有着明显的作用。Illustrated by the case of Mitsubish IPM(Intelligent Power Module) PS21767,the paper establishes a relatively complete Simplified thermal model and then carried out the research of its working temperature field in the method of finite element analysis with the thermal analysis software ——Pro / Mechanica.According to the situation above,the article comes up with an optimization program about IPM thermal performance ——using needle-shaped radiators to achieve the rapid dissemination of its exterior heat.This essay also proposes a new package style,which is to encapsulate with mixed plastic resin and aluminum alloy.The thermal analysis shows that this kind of package style has a significant positive effect on IPM chip heat dissemination.

关 键 词：IPM 有限元 热分析 PRO/MECHANICA 散热 封装 

分 类 号：TM921.51[电气工程—电力电子与电力传动] TP391.9[自动化与计算机技术—计算机应用技术]