平面波导器件封装工艺软件的研究与开发  

Research and Development of Planar Waveguide Circuit's Packaging Software

作　　者：李罡[1] 郑煜[1] 

机构地区：[1]中南大学现代复杂装备设计与极端制造教育部重点实验室,长沙410083

出　　处：《航空精密制造技术》2009年第6期48-52,57,共6页Aviation Precision Manufacturing Technology

基　　金：国家自然科学基金重点项目(50735007)

摘　　要：平面波导器件的耦合封装是制约其发展的一个瓶颈,通过研究平面波导器件的封装工艺特点,分析了封装过程对控制系统的要求。基于Visual Basic.Net开发了封装工艺软件,研究了手动调整、视觉引导粗对准、自动化对准以及点胶固化四个模块的设计方法,并对编程过程中的关键技术进行了讨论。The coupling and package of PLC (planar waveguide circuit) is the key factor for restricting its popularizing. The package technology is researched. The demand to the control system is analyzed. The packaging software base on Visual Basic.Net was developed, which included manual adjustment, machine vision guide for alignment, automation alignment and dispensing models. The key technology in the programming was discussed.

关 键 词：平面波导 封装工艺 控制软件 路径规划 遗传算法 

分 类 号：TN252[电子电信—物理电子学]