ENEPIG控制以获得优良封装基板表面处理焊区  

Control the ENEPIG Surface Treatment to Get the Excellent Solder Region of IC Substrate

作　　者：陈先明 吴炜杰 宝玥 池伟相 

机构地区：[1]方正集团珠海越亚封装基板技术有限公司

出　　处：《印制电路信息》2009年第S1期231-238,共8页Printed Circuit Information

摘　　要：本文针对ENEPIG(化镍钯浸金)技术应用于封装基板表面处理,在化镍钯浸金工艺过程中,通过对镍层上化学镀钯控制、浸金控制,获得精确的沉积厚度和金层均匀性,达到良好的接触面。并就浸金过程中的渗金问题进行优化控制,达到焊区小间距的需求。通过对ENEPIG表面处理焊区和电镀镍金表面处理焊区的Wire Bonding(引线键合)能力、可焊性、抗老化能力进行试验比较,验证了本ENEPIG控制技术同时具有优于电镀镍金的引线键合可靠性和锡焊可靠性。本ENEPIG控制技术所获得优异可靠性的表面处理,并且满足无铅组装工艺所有需求,非常适用于封装基板的表面处理制造。This article is focused on ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) technology that has application in surface treatment of packaging substrate.In the Electroless Nickel Electroless Palladium Immersion Gold technological process,through control the Electroless Palladium on the Nickel layer and control the Immersion Gold on the Palladium layer,the manufacturer can obtain precise deposition thickness and uniformity of gold layer,which made good favorable contact surface.By carrying out optimization control for seeping gold problem in immersion gold process,the manufacturer can accomplish the needs for smaller spacing between solder regions.This ENEPIG control technique obtained excellent reliability of surface treatment,and satisfied all of wants and needs in leadless packaging technology,and is applicable to surface treatment manufacture of packaging substrate.

关 键 词：封装基板 化学镀镍 ENEPIG 电镀镍 浸金工艺 可焊性 金属材料加工性能 引线键合 键合工艺 表面处理 焊区 

分 类 号：TN41[电子电信—微电子学与固体电子学]