低成本倒装片组装的断裂力学分析  

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies

作　　者：杨建生[1] 王永忠[1] 陈建军[1] 

机构地区：[1]甘肃天水永红器材厂

出　　处：《中国集成电路》2002年第6期92-96,共5页China lntegrated Circuit

摘　　要：本文论述了不同厚度的印制电路板上不完全下填充倒装芯片的焊点可靠性,着重强调了对不同裂纹(剥离)长度,焊点角上与温度相关的应力和塑料应变的确定另外,陈述了采用断裂力学法求得在下填充物和焊料掩膜之间界面处,裂纹尖端的应变能释放率和相角。Sohler joint reliability of flip ehip on various thickness of printed circuit hoard with imperfect underfill is discussed in this article. Emphasis is placed on the delamination of the temperature-dependent stress and plastic strain at the corner solder joint with different crack (delamination) lengths. Also, the strain energy release rate and phase angle at the crack tip of the interface hetween the underfiil and solder mask are obtained by fracture mechanics.

关 键 词：Fracture MECHANICS in FINITE element analysis SOLDER joint imperfect UNDERFILL strain energy release rate phase angle CRACK tip. 

分 类 号：TN405[电子电信—微电子学与固体电子学]