提高电镀填盲孔效果的研究  

The study on improving microvia-filling plating

作　　者：朱凯[1] 何为[1] 陈苑明[1] 陶志华[1] 陈世金 徐缓 

机构地区：[1]电子科技大学,四川成都610054 [2]博敏电子股份有限公司,广东梅州514000

出　　处：《印制电路信息》2013年第S1期150-155,共6页Printed Circuit Information

基　　金：广东省科技厅产学研结合项目(项目编号2012A090300007)的资助.

摘　　要：随着电子产品的持续发展,HDI印制电路板的应用越来越广泛,本文通过正交实验优化电镀填孔工艺参数,并通过控制变量法研究了通孔孔径及位置对盲孔电镀填孔效果的影响,并以金相显微镜分析盲孔的凹陷度作为考察指标。研究结果表明采用优化参数能够降低盲孔填充凹陷度,通孔对盲孔的填孔电镀效果会产生影响,随着通孔孔径的增大,对盲孔的填孔电镀越有利,同时实验还发现,若在孔金属化后通孔孔壁与盲孔底部铜层电导通有利于盲孔的填孔。With the electronic products continuous improvement, HDI has extensive application in PCB. In this paper, optimizing process parameters through orthogonal experiment was used for improving microvia-ifliing efifciency, and the effect of through-hole size and place on microvia-iflling plating had been study by control variable method, besides, the via iflling effect was proved by metallographic slicing test. Research results show that the microvia with lower dimple can be completed well by the optimum technology, and the dimple reduced while through-hole pere size increased, and it was beneifcial to microvia-iflling plating if through-hole and the bottom of microvia were conductive after hole metallization.

关 键 词：高密度互连技术 电镀填孔 通孔 

分 类 号：TN405[电子电信—微电子学与固体电子学]