高厚径比HDI板电镀能力研究  

Plating ability Of HDI with high aspect ratio item

作　　者：班向东 

机构地区：[1]天津普林电路股份有限公司,天津300250

出　　处：《印制电路信息》2013年第S1期313-316,共4页Printed Circuit Information

摘　　要：随着信息技术的不断发展,层数更多、板厚更厚、孔径更小、布线更密的PCB需求给PCB生产厂家提出的更高的要求。高纵横比与盲孔电镀是PCB电镀的两个不同的加工方向,而这两种要求并存的产品加工是电镀的难点,因此找到两者之间的平衡点至关重要。本文通过实验,找到两者兼顾的电镀参数,达到通盲孔兼顾的效果。With the development of information technology, more layers, thickness, aperture smaller, thicker wiring denser PCB needs PCB manufacturers put forward higher requirements. High aspect ratio and BMV plating are two different processing direction of PCB plating, and the two requirements of both the product processing is the dififculty of electroplating. So to ifnd a balance between the two is very important. Through the experiment, we found the electroplating parameters, achieved the balance of the blind holes.

关 键 词：高厚径比 盲孔 电镀参数 平衡点 

分 类 号：TN41[电子电信—微电子学与固体电子学]