基于非共价键的本征型自修复聚合物材料及其应用  被引量:14

Intrinsic Self-healing Polymer Materials Based on Non-covalent Bond and Their Applications

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作  者:龚征宇 张国平[1] 孙蓉[1] 汪正平[1,2] 

机构地区:[1]中国科学院深圳先进技术研究院,深圳518055 [2]香港中文大学工程学院,香港999077

出  处:《高分子通报》2015年第4期1-11,共11页Polymer Bulletin

基  金:国家自然科学基金项目(No.21201175);广东省引进创新科研团队计划资助(No.2011D052)

摘  要:自修复材料作为一种拥有结构上自愈合能力的智能材料近年来得到了快速发展。具备自修复性能的聚合物材料主要包括外援型和本征型。由于本征型自修复聚合物材料具有潜在的自修复能力,且能实现多次修复,所以该领域对于本征型自修复聚合物材料的关注越来越多。由氢键、π-π堆积、疏水作用、离子作用和主客体作用等非共价键力形成的本征型自修复聚合物体系不需要或需要极少外界能量就能实现快速、高效修复。这将是实现节约能源,社会可持续发展的重要途径。本文以不同类型的非共价键为线索,综述了近年来基于非共价键的本征型自修复聚合物材料的发展及其应用,并展望了其未来的发展方向。Self-healing materials,which can healing itself after damage,have achieved rapid development.Polymer materials with self-healing ability include extrinsic self-healing and intrinsic self-healing.There are growing concerns on intrinsic self-healing polymer materials since they have potential healing ability by itself and can achieve multiple repairing.Without or little external energy,intrinsic self-healing based on non-covalent interaction can be accomplished efficiently within few minutes.Those self-healing materials have a great significance for realizing energy conservation and sustainable development of society.Using different types of non-covalent bonds as clues,this review depicts the progress and application of intrinsic self-healing polymer materials.Furthermore,the developing direction of this field was also prospected in this review.

关 键 词:非共价键 本征型 自修复 智能材料 

分 类 号:O631.1[理学—高分子化学]

 

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