激光直写制备厚膜导体技术研究  

Study of Thick Film Conductor Direct Preparation by Laser Micro-cladding Technique

作　　者：陈轶群[1] 李祥友[1] 李慧玲[1] 曾晓雁[1] 

机构地区：[1]华中科技大学激光技术国家重点实验室,湖北武汉430074

出　　处：《电子元件与材料》2004年第8期4-6,10,共4页Electronic Components And Materials

基　　金：国家自然科学基金(No. 50075030);国家863高新技术资助项目(2001AA421290)

摘　　要：采用激光微细熔覆直写布线的方法在陶瓷基板上制备高密度厚膜导体.导体具有光滑平整的表面、高分辨率(最小线宽30 μm)、高附着强度、良好的电气性能,优良的可焊性,且不需要掩模,因此相比传统丝网印刷工艺更灵活更经济.研究了预置涂层厚度、激光功率密度和激光扫描速度对导体线宽的影响,提出了最佳工艺参数范围:涂层厚度4～15μm,激光功率密度1～4.8 W/mm2,扫描速度＜35 mm/s.所得线宽为30～150μm.并分析了陶瓷板上激光直写布线的机理.Thick film conductor was prepared on ceramic substrate by laser micro-cladding.The experimental results demonstrated that the conductor had excellent surface quality, excellent line definition(minimum width 30靘),strong adhesion,excellent conductive properties,excellent soldering ability and no mask. The effects of coating thickness,laser power density and laser scanning speed on conductor width were studied in detail, and the optimal range of these factors was given. Its coating thickness is 4~15 mm, laser power density is 1~4.8 W/mm2, scanning speed is <35 mm/s. The line width 30~150 mm was given. The mechanism of conductor formation was analyzed.

关 键 词：激光技术 激光微细熔覆 导体 厚膜电路 陶瓷基板 

分 类 号：TN249[电子电信—物理电子学]