等离子体沉积碳氟聚合物薄膜的纳米摩擦性能研究  被引量:3

Atomic Force Microscopic Study of the Nanofriction Behavior of Fluorocarbon Films on Silicon Substrate Deposited by Inductively Coupled Plasma

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作  者:鲍海飞[1] 熊斌[1] 陆德仁[1] 李昕欣[1] 王跃林[1] 

机构地区:[1]中国科学院上海微系统与信息技术研究所传感技术国家重点实验室,上海200050

出  处:《摩擦学学报》2004年第4期304-307,共4页Tribology

基  金:国家973重大基础研究集成微光机电系统项目资助(G1999033101).

摘  要:利用原子力显微镜研究了感应等离子体刻蚀加工过程中单晶硅表面形成的不同厚度的碳氟聚合物薄膜的纳米摩擦特性,并针对几种不同的摩擦模式探讨了原子力显微镜探针在不同厚度的碳氟聚合物薄膜表面的摩擦行为.结果表明,同硅基体相比,聚合物薄膜的摩擦力信号明显较弱,薄膜的纳米摩擦特性同其厚度密切相关;碳氟聚合物薄膜在同Si3N4针尖接触过程中可向针尖表面转移,从而对针尖起修饰作用,以减轻微观摩擦磨损.Atomic force microscopy was used to investigate the nanofriction behavior of fluorocarbon films deposited on single crystal Si substrate by surface technology systems' inductively coupled system. Thus the modification of the films with different thickness on the surface of the Si3N4 tip and its effect on the nanofriction behavior of the films were examined by scanning the original Si surface and the films using an original new tip or the film-modified tip. It was found that the films have much smaller friction forces than the Si substrate. The nanofriction behavior of the films is closely related to the thickness, while it is liable to transfer onto the tip surface and hence to modify the tip surface during the scanning, which contributes to decrease the nanofriction and wear of the film.

关 键 词:碳氟聚合物 薄膜 纳米摩擦特性 微机电系统 

分 类 号:TH117.3[机械工程—机械设计及理论]

 

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