钛阳极磁控溅射钽的工艺研究  

Magnetron Sputtering Tantalum Film Technology for Titanium-Coated Anode

作　　者：潘建跃 孙凤梅[2] 罗启富[3] 

机构地区：[1]镇江市特种合金材料厂,江苏镇江212006 [2]南京信息职业技术学院微电子系,江苏南京210013 [3]江苏大学材料科学与工程学院,江苏镇江212013

出　　处：《材料保护》2004年第10期26-28,共3页Materials Protection

摘　　要：　涂层钛阳极在使用中会因氧化而失效。为了开发新型的涂层钛阳极,进行了磁控溅射钽作钛阳极底层的研究。通过改变溅射功率、氩气压力及溅射时间,对不同工艺条件下沉积的钽膜进行了分析。用XRD分析了溅射层的成分及相结构;通过SEM,AFM观察了钽膜的微观形貌和颗粒尺寸;用拉开法测定了钽膜的附着力。综合分析了影响钽膜质量的因素,推荐磁控溅射3～4μm钽膜的优化工艺为:功率100～130W,氩气压力0.1～0.3Pa,溅射时间45～50min。钽膜作为底层可提高二氧化铅阳极的使用寿命40倍以上。Ti-coated anode would failure for oxidation in use.Magnetron sputtering tantalum (Ta) was studied using as the bottom layer of Ti-coated anode to develop new type anode.Ta coatings deposited under different power and Arpressure and sputtering time were analyzed.The composition and phase structure of sputtering layer were analyzed by XRD, the morphology and particle size of Ta film were observed by SEM and AFM, and the adhesion was tested by pulling-off method.The optimized techniques of magnetron sputtering 3～4μm Tafilm are recommended that power is 100～130 W, Ar pressure is 0.1-0.3 Pa and time is 45～50 minutes.As bottom layer, Ta film can prolong the life of lead dioxide anode more than 40 times.

关 键 词：磁控溅射 钽膜 涂层钛阳极 工艺 

分 类 号：TG174.444[金属学及工艺—金属表面处理]