绿色无铅电子焊料的研究与应用进展  

Progress of Research and Application of Lead-free Solder

作　　者：张曙光[1] 何礼君[1] 张少明[1] 石力开[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《材料导报》2004年第6期72-75,共4页Materials Reports

基　　金：国家"十五"863计划支持项目(2002AA322040)

摘　　要：概述了关于无铅电子焊料全球范围的立法与研发计划、国内外无铅焊料的发展现状及所取得的研究成果,探讨了无铅焊料合金的专利问题,进行了无铅软钎焊技术可行性、经济性和可靠性分析,介绍了无铅焊料的应用情况,并展望了前景。The global legal regulations on leaded solder and research and development programs on lead-freesolder around the world are briefly introduced.The progress and main achievements of lead-free solder are re-viewed.The patent problem on lead-free solder materials,the feasibility,economic aspect,and reliability of lead-freesoldering technology are analysed.The current status and future prospects of application of lead-free soldering are pre-sented.

关 键 词：无铅焊料 微电子组装 焊接 环境保护 软钎焊材料 

分 类 号：TG425.1[金属学及工艺—焊接]