微电子封装化学镀镍工艺研究及应用  

Study of electroless nickel plating on micro-electronics packaging and its applications

作　　者：刘圣迁[1] 刘晓敏[1] 张志谦[1] 刘巧明[1] 夏传义[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电镀与涂饰》2005年第1期40-43,共4页Electroplating & Finishing

摘　　要：　在微细图形上实施化学镀有一定的技术难度,尤其是在批量生产中。通过研究工艺条件对镀层的影响,探索出微电子封装化学镀镍的工艺参数的适宜范围分别为:23～27g/L的镍盐、4～6g/L的还原剂、pH值4 5左右、温度(90±2)℃。经试验筛选出合适的镀液稳定剂Tl2+,使批量生产的封装微细图形不"糊片",无镍粒。用X射线荧光测厚仪及化学分析方法对生产过程中的镀液成分进行测定,确定了维护镀液所用的补充液的组分,从而延长了镀液的使用寿命,满足了微电子封装批量生产的要求。Electroless plating on superfine graphs has been found to be difficult, especially in mass production. The influences of the process conditions of electroless nickel plating for micro-electronic packaging on the nickel deposits were studied, and thereby suitable process parameter ranges were obtained as follows: 23～27 g/L of nickel salt, 4～6 g/L of reducer,pH value of about 4.5 and temperature of (90±2) ℃. The superfine graphs in packages having no burnt area and nickel particles were obtained by using the suitable stabilizer of Tl^(2+) which was selected out by test. The bath components were analyzed with X-ray fluorescence thickness gauge and by chemical analysis method. The supplement solution of the bath was developed, and the bath life was extended consequently. The electroless nickel plating technique for micro-electronic packages can meet the demands of mass production.

关 键 词：微电子封装 化学镀镍 稳定剂 补充液 

分 类 号：TG178[金属学及工艺—金属表面处理] TQ153.2[金属学及工艺—金属学]