Sn-Ag-In系焊料的实用化与今后的课题  

Practical Use Situation and Problems of the Sn-Ag-In System Solder

作　　者：许宝兴[1] 

机构地区：[1]中国电子科技集团公司第二研究所,030024

出　　处：《印制电路信息》2005年第2期58-62,共5页Printed Circuit Information

摘　　要：焊料合金低融点化是实现无铅化的关键技术。经研究表明,Sn-Ag-In系焊料在焊接可靠性方面能够满足要求,有广阔的应用前景。To lower melting point of solder alloys is the key technique to realize lead-free to turn. It was shown by research, the Sn-Ag-In system solder can satisfy the request in soldering reliability, has vast application foreground.

关 键 词：焊料 无铅化 可靠性 关键技术 实用化 合金 焊接 

分 类 号：TN405[电子电信—微电子学与固体电子学] TG42[金属学及工艺—焊接]