印制电路板通孔的电镀技术  

Technology of Through Hole Plating of Printed Circuit Board

作　　者：陈智栋[1] 梁学敏[1] 光崎尚利 

机构地区：[1]江苏工业学院,213016 [2]太洋テクノサヒSFT研究所

出　　处：《印制电路信息》2003年第7期42-45,共4页Printed Circuit Information

摘　　要：印制板通孔的金属化是一个极其复杂的过程,它涉及到去残渣、活化、化学镀铜和电镀铜,为了得到品质优良的产品,必须严格控制每一项操作。本文通过对生产现场易出现的问题,提出了对上述各工序管理的注意点。Through hole plating of printed circuit board is a very complicated process. Hole metallization involves the procedures of dismear, activation, electroless plating and electroplate copper. We must strictly control every part of the operation so as to produce top-grade products. In the paper we will bring up several cautions in the working procedures mentioned above, which quite often come out at the producing spot.

关 键 词：印制电路板 导通孔 电镀 金属化 化学镀铜 电镀铜 工序管理 绝缘树脂 溶液管理 

分 类 号：TN405[电子电信—微电子学与固体电子学] TQ153[化学工程—电化学工业]