先进芯片封装技术  

The Advanced Chip Package Technology

作　　者：鲜飞[1] 

机构地区：[1]烽火通信科技股份有限公司,430074

出　　处：《印制电路信息》2003年第7期58-61,共4页Printed Circuit Information

摘　　要：微电子技术的飞速发展也同时推动了新型芯片封装技术的研究和开发。本文主要介绍了几种新型芯片封装技术的特点,并对未来的发展趋势及方向进行了初步分析。The rapid development of microelectronic technology has been giving impetus to the development of new chip package technology. Characteristics of several advanced chip package technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested.

关 键 词：芯片 封装 微电子技术 发展趋势 集成电路 BGA CSP COB FLIP Chip MCM 

分 类 号：TN305.94[电子电信—物理电子学]