真空压渗铸造铝基电子封装复合材料研究  

An Investigution of Aluminium Matrix Composites for Electronic Pack-aging Fabricated by Vacuum Preesure Infiltration Casting

作　　者：喻学斌[1] 张国定[1] 吴人洁[1] 

机构地区：[1]上海交通大学复合材料研究所

出　　处：《材料工程》1994年第6期9-12,共4页Journal of Materials Engineering

摘　　要：叙述了真空反压渗透铸造法制铝基电子封装复合材料的过程；测试了ＳｉＣｐ、镀铜碳短纤维、Ｐ１３０石墨短纤维、Ａｌ２Ｏ３短纤维、石墨磷片、石墨颗粒增强铝硅铸造合金复合材料的密度、孔积率和增强体的体积分数；给出了每种复合材料的金相照片，分析了不同增强体、预制件制造方法和混杂增强对铝基复合材料的体积分数、孔积率等方面的影响。hs poper spoaks in detail the vacuum pressure infiltration casting process used for fabricating alumini-um matrix composites for elctronic packaging. We measured the density,volume fraction and porosity of the composites which are reinforced with SiC,copper-plating short carton fibers, P130 graphite shotr fibers,Al2O3 short fibers,graphite phosphoplates and graphite particulates. In the paper the metallographs are given and we analyses the effect of different reinforcements,methods of making preform and hybrid re-inforce on the volume fraction and porosity of aluminium matrix composites for electronic packaging.

关 键 词：真空铸造 铝 复合材料 电子封装 

分 类 号：TG249.9[金属学及工艺—铸造]