微波电路模块封装技术  

Packaging Technologies for Microwave Circuit Modules

作　　者：田尔文 

机构地区：[1]江苏南京电子工业部第五十五研究所

出　　处：《微电子学》1994年第5期35-43,共9页Microelectronics

摘　　要：本文论述基于单片集成电路的微波模块（组件）的封装特征，介绍了技术关键和发展水平，包括近年来多芯片、多层面、多功能的三多趋向，向小型化和表面组装的推移及封装衬底选择。在集成电路和微波模块批量或规模生产中，无论就性能还是就成本而言，封装技术都是值得重视的关键技术。Feattires of microwave module packaging based on monolithic IC’s are dealt with in the paper. The state-of- the-art of the technology and some critical techniques are reviewed,including the developing trends toward multi-chip.multi-level and multi-function packaging.and the move toward miniturization and surface mount.The selection of package subtrate is also introduced,For mass production of integrated cir- cuits and microwave modules.packaging is very critical in terms of either performance or cost.

关 键 词：微波电路 模块 封装 微波集成电路 

分 类 号：TN454[电子电信—微电子学与固体电子学]