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机构地区:[1]中国科学院微电子研究所纳米加工与新器件集成实验室,北京100029
出 处:《电子工业专用设备》2005年第2期26-32,共7页Equipment for Electronic Products Manufacturing
基 金:973(G200036504);国家自然科学基金资助项目(60236010)
摘 要:在下一代光刻技术中,光刻的成本越来越高,这使得工业界开始寻找新的技术。纳米压印作为非光学的下一代光刻技术,具有分辨率高、成本低、产率高等诸多优点,因而可能应用于将来的半导体制造中。同时,纳米压印也可以用于微机电系统(MEMS)和其他纳米结构的图形复制。纳米压印光刻技术主要包括热压印、紫外固化压印和微接触法压印。介绍了在这3种纳米压印光刻技术中,压印模版制作的制作工艺和模版表面的防粘连处理,并且讨论3种压印方法适用的不同领域。The cost of Optical lithography in Next Generation Lithography becomes higher and higher, which make the industry look for new methods for integrated circuits production. Nanoimprint, as a non-optical lithography technology , has demonstrated its ability for semiconductor manufacturing by offering resolution below sub-10nm feature size, high throughput and low cost. And also, nanoimprint can be used in MEMS and other applications to reproduce nanostructure. There are a few varieties in nanoimprint, which can be loosely divided into hot embossing, UV-cured imprinting, and micro-contact printing. In this paper, the stamp fabrication process and anti-adhesive layer for these three different techniques are discussed in detail respectively, and different application fields of these three different techniques are presented.
分 类 号:TN305.7[电子电信—物理电子学]
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