三元合金Cu＿（76）Ni＿（15）Sn＿9的离子溅射研究  

PREFERENTIAL SPUTTERING OF THE TERNARY ALLOY SYSTEM Cu_(76)Ni_(15)Sn_9

作　　者：王震遐[1] 潘冀生[1] 章骥平[1] 王传珊[1] 李欣年[1] 周树鑫[1] 罗文芸[1] 张慧明[1] 曾跃武[1] 赵烈[1] 

机构地区：[1]中国科学院上海原子核研究所,上海科学技术大学射线应用研究所,杭州大学中心实验室

出　　处：《物理学报》1994年第12期2009-2015,共7页Acta Physica Sinica

摘　　要：在２７ｋｅＶＡｒ＿＋离子轰击时，用收集膜技术结合俄歇谱仪（ＡＥＳ），研究了三元合金Ｃｕ＿（７６）Ｎｉ＿（１５）Ｓｎ＿９系统的择优溅射行为。同时使用扫描电子显微镜（ＳＥＭ）与电子探针微分析（ＥＰＭＡ）．观察了靶点表面形貌变化并测定了形貌特征微区的合金组份原子的相对百分浓度。结果表明，Ｃｕ原子较Ｎｉ原子、Ｎｉ原子较Ｓｎ原子，在所测定范围（０─６０°）内择优发射。最后讨论了靶点表面形貌特征和“元素局域富集”现象对择优溅射过程的影响。he preferential sputtering of the ternary alloy system Cu_(76)Ni_(15)Sn_9 has been stu-died under 27keV argon ion bombardment at normal incidence using collection film technique combined with Auger electron spectroscopy analysis.After sputtering tar-get surface was examined in a scanning electron microscope,and the surface compo-sition was measured with electron probe microanalyser for topographical features of different micro- region surface. The experimental results showed that the preferred ejection of Cu atoms compared with Ni atoms and of Ni atoms compared with Sn atoms take place over the whole range of the measured ejection angle(0─60°)。The influence of the topographical features and“locally rich element”phenomenonon the ejection atoms are discussed.

关 键 词：离子溅射 铜镍锡 AES SEM EPMA 

分 类 号：TN305.92[电子电信—物理电子学]