聚乙二醇对纳米多孔二氧化硅薄膜性能的影响  

Effects of Poly(Ethylene glycol) on Properties of Nanoporous Silica Film

作　　者：王娟[1] 张长瑞[1] 冯坚[1] 

机构地区：[1]国防科技大学航天与材料工程学院新型陶瓷纤维及其复合材料国防科技重点实验室,湖南长沙410073

出　　处：《无机材料学报》2005年第2期435-441,共7页Journal of Inorganic Materials

基　　金：国防预研项目(41312040307)

摘　　要：以聚乙二醇(PEG)为添加剂,正硅酸乙酯(TEOS)为先驱体,采用溶胶-凝胶法、结合 旋转涂胶和超临界干燥等工艺在硅片上制备了纳米多孔SiO2薄膜.利用FTIR、TG-DTA、 AFM和椭偏仪研究了该SiO2薄膜的性能.与未加.PEG的SiO2薄膜相比,加入PEG得到 的SiO2薄膜表面粗糙度增大,但孔隙率较高,介电常数可降至2.0以下.PEG参与并修饰了 TEOS的溶胶-凝胶过程.加入PEG制备的SiO2薄膜因含有Si-OH基团而呈亲水性,该薄 膜经三甲基氯硅烷(TMCS)修饰后为疏水性.Crack-free homogeneous nanoporous silica films on silicon wafers were synthesized via supercritical drying of wet gel films obtained by spin coating the polymeric silica sol using the sol-gel method with tetraethoxysilane (TEOS) as precursor and poly(ethylene glycol)(PEG) as additive. The nanoporous silica films were characterized by FTIR, TG-DTA, AFM and spectroellipsometer. The surface of silica films prepared with PEG was rough compared to that of films without PEG. The silica film with PEG had higher porosity and lower dielectric constant. Its dielectric constant could be reduced below 2.0. PEG not only participated in but also modified the sol-gel process of TEOS. The silica film with PEG originally was hydrophilic because of its Si-OH structure and then became hydrophobic after modified with trimethylchlorosilane(TMCS).

关 键 词：纳米多孔二氧化硅薄膜 溶胶-凝胶 聚乙二醇 低介电常数 

分 类 号：TB383[一般工业技术—材料科学与工程]