基于表面微机械和压电薄膜技术的新型微谐振器  

NEW MICRORESONATORS BASED ON SURFACE MICROMACHINE AND PIEZOELECTRIC THIN FILM TECHNOLOGY

作　　者：邹英寅[1] 王跃林[1] 

机构地区：[1]浙江大学信息与电子工程学系,杭州310008

出　　处：《真空科学与技术》1994年第4期307-308,共2页Vacuum Science and Technology

基　　金：国家自然科学青年基金;国家传感技术联合开放实验室资助

摘　　要：一种基于表面微机械和压电薄膜技术的体声波器件新结构，是在多晶硅膜片上演积氧化锌（ZnO）压电薄膜。ZnO膜是在c轴采用S枪磁控反应溅射定向生长，而多晶硅膜片采用表面微机械技术制备。采用平面工艺，对氧化牺牲层化学蚀刻和照像腐蚀，制得表面微结构，其性能与在硅膜片上各向异性的传统制作工艺比较，在制作简易性、生产量和可靠性方面都有重大进展。已制成的微谐振器尺寸为15μm×150μm和250μm×250μm，其谐振频率为559．05MHz。A new structure for bulk acoustic are(BAW) microresonators based on surface micromachine and piezoelectric thin films technology has been presented The structure is formed of thin film of piezoelectric zine oxide(ZnO)deposited on a polysilicon membrane The ZnO film is c-axis oriented and groen by S-gun magnetron sputtering while the polysificon micromachine The abilityato fabricate this surface microstructure in planar process through a combination of wet chemical etching of a sacrificial oxide space and lift-off photolithography may represent a significant improvement in ease of fabrication yield and reiability over previous fabrication technique based on anisotropic etching of silicon The size of microresonators are 150μm× 150μm and 250μm×250μm. The resonant frequency is 559.05MHz.

关 键 词：谐振器 体声波器件 表面微机械 压电薄膜 

分 类 号：TN75[电子电信—电路与系统] TN304.055