新型多晶硅薄膜热膨胀系数在线测试结构  

A Novel Surface-Micromachined Structure For On-Line Measuring Thermal Expansion Coefficient of Polysilicon Thin Films

作　　者：张宇星[1] 黄庆安[1] 李伟华[1] 

机构地区：[1]东南大学MEMS教育部重点实验室,南京210096

出　　处：《Journal of Semiconductors》2005年第4期840-845,共6页半导体学报（英文版）

基　　金：国家高技术研究发展计划资助项目(批准号:2002AA404010)~~

摘　　要：提出了一种新型多晶硅薄膜热膨胀系数的在线测试结构.给出了热电机械耦合模型和测试方法、结构参数设计的优化方案及误差分析,并利用ANSYS软件进行模拟.该结构测量方便,独立性较高,误差较小,用电学量形式输出,对于薄膜热膨胀系数的在线检测有较高的参考价值.This paper presents a novel structure for in situ determining thermal expansion coefficient of polysilicon thin films.A thermal-electro-mechanical compliant model is provided and confirmed with ANSYS software and some optimized parameters are also achieved through simulations.The structure has many advantages such as high precision without any particular requirements (vacuum or sealed chamber).Furthermore,the results of test are all presented in electrical form.

关 键 词：MEMS 多晶硅 热膨胀系数 在线检测 

分 类 号：TN386[电子电信—物理电子学]