键合技术的研究进展及应用  

Research Advances and Applications in Wafer Bonding Technology

作　　者：王慧[1] 沈光地[1] 高国[1] 梁庭[1] 

机构地区：[1]北京工业大学光电子实验室,北京100022

出　　处：《半导体技术》2005年第7期6-10,共5页Semiconductor Technology

摘　　要：晶片直接键合技术是材料集成的一项新工艺,是近年来集成光电子领域的研究热点之一。利用键合技术可以集成晶格或晶向失配的材料,制造传统外延生长技术不能制造的结构和器件。概括介绍了近年来Ⅲ-Ⅴ族化合物半导体材料键合技术的最新研究进展及其在光电子器件和集成领域的应用。Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field. Over coming lattice and orientation mismatch, direct wafer bonding allows fabricating of structures and devices which can get through hetero-epitaxial growth. Research advances and applications of direct wafer bonding of Ⅲ-Ⅴ compound semiconductors in optoelectronics device and its integration are generalized.

关 键 词：晶片直接键合 Ⅲ-Ⅴ族化合物 氮化镓 光电子集成 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]