真空压渗铸造铝基电子封装复合材料研究  

Study on Manufacturing Aluminium Matrix Composites for Electronic Packaging Using Vacuum Pressure infiltration Casting

作　　者：喻学斌[1] 张国定[1] 吴人洁[1] 

机构地区：[1]上海交通大学复合材料研究所

出　　处：《铸造》1994年第11期1-5,共5页Foundry

摘　　要：叙述了真空反压渗透铸造法制取铝基电子封装复合材料的过程；测试了ＳｉＣｐ、镀铜碳短纤维、Ｐ１３０石墨短纤维、Ａｌ２Ｏ３短纤维、磷片石墨、石墨颗粒增强铝硅铸造合金复合材料的密度、孔积率和增强体的体积份数；给出了每种复合材料的金相照片，分析了不同增强体、预制件的制造方法和混杂增强对铝基复合材料的体积份数、孔积率等的影响。Manufacturing process of aluminium matrix composites for electronic packaging was described using the vacuum pressue infiltration casting, the density, volume fraction and porosity of the Al-Si cast alloy composites which are reinforced with SiCp, copperplating short carbon fibers, P130 graphite short fibers, Al2O3 short fibers, graphite phosphoplates and graphite grains were measured, the metallographs for each composite material were given and effects of different reinforcements, manufacturing methods of preform and hybrid reinforce on the volume fraction and porosite of aluminium matrix composite for electronic packaging were also analysed.

关 键 词：真空铸造 电子封装 金属复合材料 铝基 

分 类 号：TN604[电子电信—电路与系统] TG29[金属学及工艺—铸造]