浅谈光刻胶在集成电路制造中的应用性能  

Application Performance of Photoresist in IC Field

作　　者：马建霞[1] 吴纬国[1] 张庆中[1] 贾宇明[1] 

机构地区：[1]电子科技大学微电子与固体电子学院,成都610054

出　　处：《半导体技术》2005年第6期32-36,共5页Semiconductor Technology

摘　　要：光刻胶技术是曝光技术中重要的组成部分,高性能的曝光工具需要有与之相配套的高性能的光刻胶才能真正获得高分辨率的加工能力。主要围绕光刻胶在集成电路制造中的应用,对其反应机理及应用性能指标进行阐述,重点从工艺的角度去提出新的研究方向。Photoresist technology is the important constitute of exposure technology, high performance resolution can be attained by using high performance exposure tools with matched high performance photoresist .The Paper mainly found on the application of photoresist in the process of IC fabrication to summarize the facets of reaction mechanism ,performance index parameters and finally to indicate some new development directions in terms with process evolution target.

关 键 词：光刻胶 应用性能 反应机理 集成电路 光刻 

分 类 号：TN305.7[电子电信—物理电子学]