导热胶粘剂研究  

Thermally Conductive Adhesives

作　　者：周文英[1] 齐暑华[1] 李国新[1] 牛国良[2] 寇静利[2] 

机构地区：[1]西北工业大学应用化学系,西安710072 [2]中国航天科技集团第四研究院43研究所,西安710025

出　　处：《材料导报》2005年第5期26-29,33,共5页Materials Reports

基　　金：国防预研项目(N_3HB1811)

摘　　要：导热胶粘剂因良好的导热及力学性能广泛应用于微电子封装以及热界面材料,对于电子元器件散热具有重要意义。介绍了导热胶粘利导热原理、导热模型,分析了影响导热率的因素,以及提高导热率的途径;综述了导热非绝缘及导热绝缘胶粘剂的研究进展,最后展望了其应用前景。The thermally conductive adhesives have become increasingly important to microelectronic packaging and thermal interface materials due to their good thermal conducting and mechanical properties.In this paper,the thermal conduc- ting mechanism and models of thermally conductive adhesive are described,the factors affecting thermal conductivity and approaches of improving thermal conducting are discussed,advances in research on thermaly conductive adhesives and thermal- ly conductive insulating adhesives are reviewed,and the applications are put forward.

关 键 词：导热胶粘剂 微电子封装 电子元器件 界面材料 力学性能 导热模型 研究进展 导热率 热绝缘 应用 

分 类 号：TN405.94[电子电信—微电子学与固体电子学] TQ436[化学工程]