集成电路粘片机视觉检测技术研究  

Vision Inspection Technology of IC Die Bonder

作　　者：郭强生[1] 靳卫国[1] 周庆亚[1] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京东燕郊101601

出　　处：《电子工业专用设备》2005年第7期34-40,共7页Equipment for Electronic Products Manufacturing

摘　　要：集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。基于视觉检测的全自动集成电路粘片机,其视觉检测技术是关键及核心技术。利用图像处理、模式识别技术,采用固定阈值分割、图像投影、像素统计、区域生长、边界坐标点提取、模板匹配等方法,完成了待检测芯片的定位与墨点、缺角、崩边、角度偏移等芯片缺陷的检测。实现了贴装过程中芯片识别检测功能。IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. Visual inspection are crucial to IC Die Bonder's control system. The thesis utilizes methods of Image Processing and Pattern Recognition to complete location detection and defects detection of microchip. It uses and improves algorithms - fixed threshold segmentation, image projection, pixel number statistics, region growing, edge pixel set extract and template match - in visual inspection and achieves good results. discusses control sequence in system to solve control problems of IC Die Bonder - mutil-axis linkage, mutil-sequence cooperation and high- speed high-accuracy movement control.

关 键 词：集成电路 视觉检测 粘片机 

分 类 号：TN305.93[电子电信—物理电子学]