电子封装铝基复合材料热循环曲线研究  

INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING

作　　者：喻学斌[1] 张国定[1] 吴人洁[1] 

机构地区：[1]上海交通大学复合材料研究所

出　　处：《航空材料学报》1995年第1期15-21,共7页Journal of Aeronautical Materials

摘　　要：研究了热循环对铝基复合材料热膨胀和冷却收缩曲线的影响。发现电子封装纤维增强铝基复合材料的热循环曲线是不封闭的。热循环曲线的形状、不封闭程度同增强体的种类、测试方向、热循环温度区间以及热循环次数等因素有关。利用细观力学理论较好地解释了这些现象。The effects of thermal circling on the curve of heat expansion and cold contraction are investigated. Itis found that the thermal circling curves of aluminum-matrix composites reinforced with carbon fiber forelectronic packaging are not close. The curve shape and close extent of thermal circling are related to rein-forcernents ,sarnple orientation ,thermal circling number of times and temperature range. These phenomenaare explained by micro-mechanics.

关 键 词：铝基复合材料 热循环曲线 热膨胀 电子封装 

分 类 号：TN305.94[电子电信—物理电子学]