单晶硅微构件力学特性片上测试系统  

ON-CHIP SYSTEM FOR MEASURING MECHANICAL PROPERTIES OF SINGLE-CRYSTAL SILICON MICRO STRUCTURES

作　　者：苏才钧[1] 吴昊[1] 郭占社[1] 孟永钢[1] 温诗铸[1] 

机构地区：[1]清华大学摩擦学国家重点实验室,北京100084

出　　处：《机械强度》2005年第4期456-459,共4页Journal of Mechanical Strength

基　　金：国家自然科学基金(50135040);中国基础研究基金(2003CB716205);清华大学基础研究基金(Jc2003013)资助~~

摘　　要：设计一种集成静电梳状驱动器和测试结构,专用于单晶硅微构件断裂、疲劳性能测试的片上测试系统。详细介绍测试系统的结构和工作原理。对静电梳状驱动器的驱动电压—驱动力关系、结构刚度以及谐振频率进行计算。利用MEMS(microelectromechanicalsystem)体硅工艺制造该测试系统,加工得到的测试系统在显微镜工作台上进行静态和动态弯曲实验,并将实验结果与ANSYS分析结果进行对比。结果表明,该测试系统性能稳定,能够实现对单晶硅微构件的弯曲断裂和疲劳测试。An on-chip system for measuring fracture and fatigue properties of single-crystal silicon micro structures has been designed, in which the testing samples and the electrostatic comb actuators are integrated. The structures and operating principle of the testing system are detailedly described in the article. The relationship of driving voltage and driving force, structural stiffness and resonant frequency of the electrostatic comb actuators are calculated. The testing system is fabricated using MEMS（ micro-electro-mechanical system） bulk-silicon processing techniques. Static and dynamic bending experiments of the fabricated testing system are carried on the microscope stage. The results of the experiments are compared and contrasted with those of the ANSYS simulation, which shows that this testing system is stable and is able to measure fracture and fatigue properties of single-crystal silicon micro structures.

关 键 词：微电子机械系统 单晶硅 片上测试 静电梳状驱动器 疲劳 

分 类 号：TB302.3[一般工业技术—材料科学与工程]