集成电路抗腐蚀能力的研究  

The research of corrosion resistance for ICs

作　　者：杜迎[1] 管光宝[1] 

机构地区：[1]中国电子科技集团有限公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2005年第4期30-33,共4页Electronic Product Reliability and Environmental Testing

摘　　要：首先介绍了塑封电路、玻璃封装电路和陶封电路的构成材料,然后分别选取这3种电路的若干只样品,按几种试验条件进行了盐雾试验,针对试验后在电路上出现的腐蚀现象进行了理论分析,最后总结了3种电路各自的抗腐蚀能力。It firstly introduced the composition of the PE，ceramic and glass package circuits， A few samples selected from each type circuits were subject to salt fog tests under several kinds of testing conditions，The corrosive phenomena after tests were analyzed theoretically， Finally the corrosion resistances of the three kinds of circuits were summarized。

关 键 词：集成电路 腐蚀 盐雾 封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]