铜银系导电复合材料腐蚀失效研究  

CORROSION FAILURE OF COMPLEX ELECTRICAL CONDUCTIVE MATIERALS FILLED WITH COPPER AND SILVER POWDERS

作　　者：朱华[1] 甘复兴[1] 

机构地区：[1]武汉大学资源与环境科学学院,武汉430072

出　　处：《中国腐蚀与防护学报》2005年第4期245-249,共5页Journal of Chinese Society For Corrosion and Protection

基　　金：国家自然科学基金面上项目(50271049)

摘　　要：采用无氰化学镀工艺,研制出一种导电性良好的镀银铜粉,粉末体积电阻率小于2×10-4Ω·cm,用该粉末为填料制成的导电胶,导电率高(导电填料与树脂的重量比为75:25时,体积电阻率为5×10-4Ω·cm)、抗迁移能力强(比银粉导电胶提高近百倍)、导电稳定(经60℃相对湿度100%湿热试验1000h,体积电阻率升高小于20%).采用粉末微电极技术研究了导电胶抗迁移的机理,结果表明电偶效应是该导电胶具有抗迁移作用的主要原因,铜作为阳极抑制作为阴极的银的溶解,从而降低银形成枝晶的几率.One new kind of silver-plated copper powder with high conductivity （volume resistivity of the powder is less than 2×10^-4Ω·cm） was developed by the eleetroless plating without cyanide. The ECAs filled with this silver-plated copper powder exhibit high conductivity （ the volume resistivity of ECAs is less than 5×10^-4Ω·cm when the mixing proportion of the resin to powder is 25：75 by weight） , high migration-resistance （the shortcut time is 100 time longer than silver-filled ECAs in the migration test） and high electric conductive stability （the volume resistivity increase is not more than 20% after 1000 hours humid-heat test in the condition of 60℃ and RH100% ）. The mechanism of anti-migration was studied using powder mieroelectrode technique and other electrochemical methods. The results show galvanic coupling effect plays an important role in the anti-migration. Copper as anode restrains cathodic silver dissolved during dissolution then decreases the probability of dendritic growth.

关 键 词：镀银铜粉 导电胶 腐蚀失效 粉末微电极 

分 类 号：TG172[金属学及工艺—金属表面处理]