LIGA技术的掩模制造  被引量:4

MASK FABRICATION OF LIGA TECHNIQUE

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作  者:伊福廷[1] 吴坚武 晋明[1] 洗鼎昌[1] 刘金声[1] 王乃强[1] 

机构地区:[1]中国科学院,北京高能物理研究所,北京航天工业总公司

出  处:《微细加工技术》1995年第2期33-37,共5页Microfabrication Technology

摘  要:LIGA技术是近几年才发展起来的一门新的技术,包括光刻、电铸和塑铸。由于要进行深度X光曝光,所用的同步辐射X光较硬,这一曝光条件相应就需要X光掩模吸收体有较大厚度和较高的加工精度,这样才能够阻挡住X光,同时保证较高的光刻精度。这种掩模的加工一般需要分二步完成,首先要加工出一块不太厚吸收体图形的X光掩模,然后利用同步辐射X光将这一掩模翻制成较大厚度的LIGA技术用掩模。本文是利用紫外光曝光与氩离子刻蚀相结合,制造出吸收体图形厚度2微米的X光掩模,然后用同步光将这一掩模翻制成LIGA技术用的掩模。The LIGA process which consists lithography,gavanoforming and plasticmoulding,has gotten a great develop in recent years.In this process,a hard X-ray(0.2-0. 4 nm)is used to produce a large thickness of risist pattern,and amask with a good profile and large thickness of absorb pattern is needed to ab-sorb the hard x-ray in the fabrication of a good risist pattern after X-ray expo-sure and develop. The mask for this requirements is usually finished in twosteps,first step is to fabricate a mask(first or intermidiate mask ) with a thinthickhees of absorb pattern(2-5μm),second step to make the LIGA mask withalarge thicknees of absorb pattern(10 20μm)using the first mask in expo-sure of synchrotron radiation,This is a report about the fabrication of IIGAmask using UV Iithography and dry etchirig to make first X-ray mask and syn-chrotron radiation to fabricate LIGA mask with the first X-ray mask.

关 键 词:掩模 制造 LIGA技术 X光曝光 

分 类 号:TN305.7[电子电信—物理电子学]

 

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