基于微机械系统的多芯片组件封装和特性模拟(英文)  

Characteristics simulation of MEMS packaging using multichip modules technology

作　　者：畅艺峰[1] 杨银堂[1] 李跃进[1] 

机构地区：[1]西安电子科技大学微电子所

出　　处：《功能材料与器件学报》2005年第3期347-351,共5页Journal of Functional Materials and Devices

摘　　要：基于微机械系统(MEMS)的噪声估算,提出了一种可用于微机械系统的多芯片组件(MCM)封装技术,并对封装完成后的信号噪声、输入端相对延时、接收信号的电磁干扰强度等特性进行模拟。仿真结果表明,相对已有MEMS封装技术,本文提出的多芯片组件封装技术具有显著优点。文中封装尺寸182.88mm×121.92mm。Muhichip modules （MCMs） offer an attractive approach to integrating and packaging microelectromechanical systems （MEMS）. The primary goal of this work is to explore methods of leveraging the advantages in microelectronic MCM technology for the packaging of MEMS. A fast noise estimation for MEMS packaging is given, which has the advantage of being applicable to a wide range of packaging types without modification. Simulation results show the significant improvements of MCM packaging used for MEMS over previously used approaches.

关 键 词：微机械系统 多芯片组件 仿真 

分 类 号：TN305.94[电子电信—物理电子学]