硅超薄可动悬空薄膜的弹性模量测试分析  

Measurement and analysis on Young's modulus of silicon super thin free-handing diaphragm

作　　者：赵林林[1] 徐晨[1] 霍文晓[1] 赵慧[1] 杨道虹[1] 沈光地[1] 

机构地区：[1]北京工业大学电子信息与控制工程学院,北京市光电子技术实验室北京100022

出　　处：《功能材料与器件学报》2005年第3期373-376,共4页Journal of Functional Materials and Devices

基　　金：北京市教委项目(KM200310005009)

摘　　要：利用纳米硬度计通过对超薄悬空薄膜的弯曲试验来测定硅可动悬空薄膜的弹性模量。硅悬空薄膜采用各向异性湿法腐蚀自停止技术制备。纳米硬度计测试方法精确测量了硅悬空薄膜的弯曲形变。试验研究表明,尺寸为2mm×1μm的硅悬空薄膜的弹性模量平均值为152GPa,差异为3.9%-6.8%。Young＇s modulus were measured by free-handing diaphragm bending using a nano indentation. The measurements were made on boron-doped p^＋-silicon free-handing diaphragm which were fabricated by using anisotropic wet etching techniques. The proposed method measured silicon free-handing diaphragm bending degree. dimension of φ2mm×1μm The measured mean Young＇s modulus of silicon free-handing diaphragm with is 152GPa,with 3.9%-6. 8% difference.

关 键 词：微电子机械系统 振动薄膜 杨氏模量 纳米硬度计 

分 类 号：TN305[电子电信—物理电子学]