硅片键合强度测试系统研究  

Measurement System for Wafer Bonding Strength

作　　者：陈立国[1] 孙立宁[1] 黄庆安[2] 陈涛[1] 

机构地区：[1]哈尔滨工业大学机器人研究所,黑龙江哈尔滨150001 [2]东南大学微电子中心MEMS国家教育部重点实验室,南京210096

出　　处：《测试技术学报》2005年第2期137-140,共4页Journal of Test and Measurement Technology

基　　金：国家863计划资助项目(2004AA404044)

摘　　要：　对现有的几种硅片键合强度测试方法进行总结,在裂纹传播扩散法测试机理分析的基础上,提出了测试系统需要得到的参数和功能.采用模块化设计思想,对测试系统中的精密定位、显微视觉、红外测试和控制系统等关键技术分别研究,最后将单元技术集成,研制成功测试系统样机.通过对多个键合硅片强度测试对比实验,证明了该系统的有效性.Some measurement methods of wafer bonding strength were summarized. The principle of crack-opening method was analyzed and the system parameters and function were presented. A design idea was used to develope the testing system. Some key technique modules including precision positioning, micro-vision, IR measurement and control system are studied respectively. A wafer bonding strength measurement system are designed based on integrating all the modules. Finally, the feasibility of the system is tested by some contrast experiments with different bonding samples.

关 键 词：键合强度 键合 表面能 裂纹传播扩散 测试 

分 类 号：TP24[自动化与计算机技术—检测技术与自动化装置]