磁控双靶反应共溅射(Ti,Al)N薄膜的研究  

(Ti,Al)N Films Deposited by Double-Target Reactive Magnetron Co-Sputtering

作　　者：闫梁臣[1] 熊小涛[1] 杨会生[1] 高克玮[1] 王燕斌[1] 

机构地区：[1]北京科技大学材料物理与化学系,北京100083

出　　处：《真空科学与技术学报》2005年第3期233-237,共5页Chinese Journal of Vacuum Science and Technology

摘　　要：采用磁控双靶反应共溅射技术制备出了(Ti0.5Al0.5)N耐磨硬质薄膜,其显微硬度高于35GPa,摩擦系数小于0.18。实验结果表明当N2流量较低时,(Ti,Al)N薄膜结构和性能随N2流量变化明显;当N2流量较高时,薄膜结构和性能变化缓慢。等离子体发射光谱仪(PEM)对磁控反应溅射过程监测结果表明,钛铝原子与氮原子反应存在一个临界点,低于临界点,磁控反应溅射为金属态溅射模式,高于临界点,磁控溅射向非金属态溅射模式转变,溅射速率降低。Wear resistant coatings of （Ti0.5Al0.5） N, with a hardness of 35 GPa and a friction coefficient lower than 0.18, were deposited with double-target reactive magnetron co-sputtering on steel substrate.The coatings were characterized with X-ray diffraction（XRD） and plasma photo-emission spectroscopy. The results show that low nitrogen flow-rate considerably affects the microstructures and the hardness of the coating till it increases to a certain high value. We observed that in the reactive sputtering there exists a critical nitrogen flow rate, below which Ti and Al were deposited in metallic sputtering mode, whereas above which Ti and Al were coated in non-metallic sputtering mode but at a rather low deposition rate.

关 键 词：(TI AL)N 磁控共溅射 等离子体发射光谱 金属态溅射 非金属态溅射 

分 类 号：TG174.444[金属学及工艺—金属表面处理]