电子元器件引线表面镀层的无铅化发展及展望  

DEVELOPMENT AND PROSPECT OF LEAD - FREE SURFACE COATING OF ELECTRONIC COMPONENTS/DEVICES LEAD FRAME

作　　者：刘琳[1] 薛松柏[1] 姚立华[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,210016

出　　处：《焊接》2005年第9期5-9,共5页Welding & Joining

摘　　要：主要介绍了电子元器件引线的表面镀层采用纯Sn、Sn—Cu、Sn—Bi、Ni/Pd和Ni/Pd/Au五种无铅镀层的发展,分析了各自的优缺点,着重讨论了无铅镀层的表面形貌对焊接性的影响,以及无铅镀层与目前钎焊工艺的兼容性,并对无铅镀层的发展和应用进行了展望。The development of five lead - free coatings was introduced such as pure Sn, Sn - Cu, Sn - Bi, Ni/Pd and Nil Pd/Au applied in coating electronic components/devices lead frame and the advantages and disadvantages of these coatings were analyzed. The influence of surface morphology of lead - free coating on solderability as well as the compatibility between lead - free coatings and soldering technology at present was discussed, and the development and application of lead - free coating in electronic industry were also forecasted.

关 键 词：引线 无铅表面镀层 表面形貌 表面镀层 电子元器件 无铅化 展望 SN-CU 钎焊工艺 优缺点 

分 类 号：TG454[金属学及工艺—焊接] TQ153.15[化学工程—电化学工业]