带有MU连接器接口的40Gb/s光接收模块封装技术  

Packaging Technology for 40Gb/s Optical Receiver Module with an MU-Connector Interface

作　　者：罗雁横[1] 张瑞君[1] 

机构地区：[1]中国电子科技集团公司第四十四研究所,重庆400060

出　　处：《电子与封装》2005年第9期17-19,33,共4页Electronics & Packaging

摘　　要：本文介绍了一种带有MU连接器接口的小型化40Gb/s光接收模块封装技术。详细叙述了光接收模块设计中的三个关键技术。实现了阻抗匹配最佳化,改进了电特性。Packaging technology for a compact 40Gb/s optical receiver module with an MU-connector interface is described. Three key technologies in design of optical receiver module are particularly described. Impedance matching optimization is realized and electronic characteristics are improved.

关 键 词：光接收模块 焊凸 共平面波导(CPW) 倒装芯片结构 M U连接器 封装 

分 类 号：TN305.94[电子电信—物理电子学]