化学镀铜原理、应用及研究展望  

Principle, application and research prospect of electroless copper plating

作　　者：李能斌[1] 罗韦因[1] 刘钧泉[1] 徐金来[1] 

机构地区：[1]华南理工大学工业装备与控制工程学院,广州510640

出　　处：《电镀与涂饰》2005年第10期46-50,共5页Electroplating & Finishing

摘　　要：化学镀铜技术主要用作印制线路板孔金属化和塑料电镀,其镀层具有良好的延展性、导热性和导电性。介绍了化学镀铜的应用范围与发展。强调了化学镀铜预处理的必要性及要注意的几个方面:应用易清洗的油脂作防锈剂,低碳钢件用阳极电解除油,酸洗除油与碱性除油互补等。介绍了化学镀铜的一些常用体系及其主要组分。讨论了添加剂的影响。对非金属表面化学镀铜的研究进展进行了报道。提出了化学镀铜今后的研究重点。Electroless copper plating is mainly applied to the metallization for PCB and electroplating on plastics, and copper electroless deposits have good ductibility, heat conductivility and electrical conductibility. Its application scope and development were introduced. This paper also emphasizes the necessity for pretreatment of electroless copper plating and some aspects that need attention including using grease that is easy to be cleaned as antirust agent and anodic electrolytic degreasing for low-carbon steel parts, and combined acidic decreasing and alkaline decreasing, etc. Some commonly used systems and their main components of electroless copper plating were introduced. The influences of additives were discussed. The research progress of electroless copper plating for nonmetal was reported. The research keystones of copper electroless plating were presented.

关 键 词：镀铜 化学镀铜 预处理 非金属 

分 类 号：TG178[金属学及工艺—金属表面处理]