微量稀土元素铈对Sn-Ag-Cu无铅钎料物理性能和焊点抗拉强度的影响  

Effects of rare-earth element Ce on physical properties and mechanical properties of Sn-Ag-Cu lead-free solder

作　　者：薛松柏[1] 刘琳[1] 代永峰[1] 姚立华[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2005年第10期23-26,共4页Transactions of The China Welding Institution

基　　金：南京航空航天大学引进人才科研基金项目(S0462-061)

摘　　要：研究了微量稀土元素铈对Sn-3.5Ag-0.5Cu无铅钎料的物理性能、润湿性能、焊点抗拉强度和显微组织的影响。结果表明,添加微量的铈后,钎料的导电性能提高,密度下降;铈含量(质量分数)在0.03%和0.05%时可以改善钎料的润湿性;特别是0.03%质量分数时晶粒组织最为细小均匀,焊点抗拉强度也最高;当铈含量(质量分数)大于0.1%时对钎料的性能产生不利影响,润湿时间升高,焊点抗拉强度大幅降低,因此稀土元素铈的最佳含量(质量分数)应为0.03%。Effects of rare-earth element Ce on physical properties, wetting properties, tensile strengths and microstructures of Sn-3.5Ag-0.5Cu lead-free solder were studied. Results indicate that its conductibility will be improved and its density will decrease if Ce is added into the lead-free solder. In the range of 0.03 wt.% to 0.05 wt.% of Ce, the wettability of the solder is improved, especially when the content of Ce is a-bout 0.03 wt.%, the grains of the microstructure in lead-free solder are smaller and more homogeneous and the tensile strength of the soldered joints is higher than that of the solder containing other contents of Ce. When the content of Ce is more than 0.1 wt.%, it is harmful to the properties of the Sn-3.5Ag-0.5Cu solder, the wetting time becomes longer, the values of the tensile strengths of the soldered joints become much lower. All of the results show that the optimal content of Ce in Sn-3.5Ag-0.5Cu solder is about 0.03 wt.%.

关 键 词：铈 无铅钎料 物理性能 焊点抗拉强度 

分 类 号：TG454[金属学及工艺—焊接]